Modern communication technology uses high-frequency and high-speed signals, which have higher requirements for the dielectric constant and electrical loss of materials.

This product can maintain a constant dielectric constant at high frequencies; The tangent loss is very small, making it very suitable for millimeter wave applications; The thermal expansion is very small and can be used as an ideal high-frequency packaging material. Flexible Printed Circuits (FPCs) can be connected to achieve high-speed transmission of high-frequency signals, mainly used in antenna modules for products such as smartphones, autonomous driving, and wearable devices, and have broad market prospects.

Upstream and Downstream Industries

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