UV reducing film is a special type of adhesive tape with good ductility, making it easy to expand the film and extract particles; it has certain temperature resistance and meets the use of special temperature processes, mainly used for chip cutting, electronic component cutting, and optoelectronic glass cutting.

The biggest characteristic of UV debonding film is that it has a high adhesive force before UV irradiation, which can ensure the stability of the workpiece during the processing; after UV irradiation, the adhesive force almost disappears, and the workpiece is easy to peel off without residual adhesive or impurities transferring to the surface of the workpiece.