1. Back Grinding protective film
Wafer Back Grinding is the necessary step before its assembly. Typically about 700 microns are ground to 200 microns, or even less than 50 microns. Before grinding, a protective film is applied to the active area of the wafer to protect the circuit area from scratches.
2. Use protective film for Dicing
In wafer cutting, protective film is needed to stick Dicing, which is used for placing the chip to scatter during cutting, and it is also convenient for subsequent Die Attche process to pick up the chip.